公开(公告)号：US20230077324A1

公开(公告)日：2023-03-16

申请号：US17988925

申请日：2022-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon CHOI ,  Taehun KIM ,  Youngsun LEE ,  Jaeyoung HUH

IPC: H04R3/02 ,  H04M1/03 ,  H04M1/60 ,  H04M1/02 ,  G10L15/22 ,  H04R1/04 ,  H04R1/40 ,  H04R1/28 ,  H04R3/00 ,  H04R1/02 ,  G10L21/0232

Abstract: According to certain embodiments, an electronic device comprises: first housing; a first substrate disposed in the first housing; a second housing; a second substrate disposed in the second housing; a flexible printed circuit board (FPCB) connecting the first substrate and the second substrate; a hinge hingably connecting the first housing and the second housing; a hinge cover covering the hinge, the hinge cover having a microphone hole formed therein; at least one first microphone disposed in the first housing; a speaker disposed in the second housing; and at least one second microphone disposed in the hinge, and configured to collect external sound through the microphone hole formed in the hinge cover, and mounted on a portion extending from the FPCB.

公开(公告)号：US20220330463A1

公开(公告)日：2022-10-13

申请号：US17436357

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojong KIM ,  Changhwan JIN ,  Jonghun CHOI ,  Byungchul LEE ,  Jaeyoung HUH ,  Hyunchul HONG ,  Jaeuk RYU

IPC: H05K9/00 ,  H05K1/02 ,  G01R19/10 ,  G01R15/04

Abstract: An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.

公开(公告)号：US20220091241A1

公开(公告)日：2022-03-24

申请号：US17493117

申请日：2021-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung KIM ,  Johngy LEE ,  Hojong KIM ,  Jaeyoung HUH

IPC: G01S7/4913 ,  H04N5/225 ,  G01S7/497 ,  G01S17/26

Abstract: An electronic device includes a communication circuit, a light source for emitting light of set frequencies, an image sensor for acquiring reflected light of the emitted light, a memory for storing offset values for respective reference frequencies of the set frequencies, and a processor. The processor is configured to receive a distance measurement input, identify whether the communication circuit is activated, determine that, in response to identification that the communication circuit is activated, a first frequency distinguished from a frequency used by the activated communication circuit is a frequency of the emitted light among the configured frequencies, acquire information on a distance between the electronic device and an external object, based on the reflected light of the emitted light of the first frequency, and acquire corrected distance information by applying an offset of the first frequency to the acquired distance information.

公开(公告)号：US20200212547A1

公开(公告)日：2020-07-02

申请号：US16694299

申请日：2019-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Seunggil JEON ,  Sunghoon MOON ,  Kyungwoo LEE ,  Sungchul PARK

IPC: H01Q1/27 ,  H04M1/725 ,  H04B17/318 ,  H04B1/3827 ,  H01Q1/52 ,  H01Q3/24 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a housing configured to mount at least a part of an external device operating 5th generation (5G) mobile communication, a support member connected to one region of the housing to support wearing of the electronic device with respect to one region of a user's body, a second antenna module disposed in a first region of the housing adjacent to a first antenna module among at least one antenna module included in the external device to face at least a part of the first antenna module, at least one third antenna module disposed in at least one of a second region of the housing or a third region of the support member, and at least one conductive member electrically connecting between the second antenna module and the at least one third antenna module.

公开(公告)号：US20230418328A1

公开(公告)日：2023-12-28

申请号：US18243464

申请日：2023-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeyoung HUH ,  Sungchul PARK ,  Seunggil JEON ,  Jonghoon LIM

IPC: G06F1/16 ,  H05K5/02

CPC classification number: G06F1/1618 ,  G06F1/1652 ,  G06F1/1681 ,  G06F1/1698 ,  H05K5/0226

Abstract: A foldable electronic device includes a first housing in which a first component is provided, a second housing in which a second component is provided, a hinge foldably connecting the first housing and the second housing, a flexible display extending from a first surface of the first housing to a first surface of the second housing and across an area in which the hinge is provided, and a coupler configured to transmit a signal between the first component and the second component, the coupler including a first coupler connected to the first component and a second coupler connected to the second component and provided at a position corresponding to the first coupler, the second coupler configured to transmit or receive a signal to or from the first coupler by coupling to the first coupler in a first state of the foldable electronic device.

公开(公告)号：US20230179029A1

公开(公告)日：2023-06-08

申请号：US18104472

申请日：2023-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeyoung HUH ,  Sungchul PARK ,  Hyunsub PARK ,  Jonghoon LIM

IPC: H02J50/90 ,  H02J50/40 ,  H02J7/00 ,  H02J50/12 ,  G06F1/26 ,  G06F1/16

CPC classification number: H02J50/90 ,  H02J50/402 ,  H02J7/00712 ,  H02J50/12 ,  G06F1/266 ,  G06F1/1652 ,  G06F1/1632 ,  H04M1/0216

Abstract: An electronic device according to various embodiments of the disclosure may include: a housing, a wireless charging circuit, and at least one processor electrically connected to the wireless charging circuit, the housing may include a first portion and a second portion, the second portion may change in a position relative to the first portion based on a state of the electronic device, and the at least one processor may be configured to: control the wireless charging circuit to receive first power from a power supply device through a first magnetic field having a first center and control the wireless charging circuit to receive the first power from the power supply device through a second magnetic field having a second center different from the first center, based on a positional relationship between the first portion and the second portion of the housing.

公开(公告)号：US20210249759A1

公开(公告)日：2021-08-12

申请号：US17154811

申请日：2021-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewoong JEON ,  Jaewun LEE ,  Jaeyoung HUH ,  Chanyoul PARK ,  Hojong KIM

IPC: H01Q1/24 ,  H01Q1/42 ,  H05K5/00 ,  H05K7/14

Abstract: Provided is an electronic device including an antenna module. The electronic device may include: a housing constituting an external appearance of the electronic device, a support member including a first bridge, a printed circuit board coupled to one surface of the support member, a first antenna constituting a first part of the housing and connected to the support member through the first bridge, a second antenna constituting a second part of the housing, a cut-off portion separating the first antenna and the second antenna, and a first connection member and a second connection member coupled to the first bridge. The first connection member may be connected to a ground of the printed circuit board through a first capacitor and may be disposed closer to the cut-off portion than the second connection member connected to the ground of the printed circuit board through a second capacitor. Other embodiments are also possible.

公开(公告)号：US20210144242A1

公开(公告)日：2021-05-13

申请号：US17092716

申请日：2020-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nakhyun CHOI ,  Hojong KIM ,  Hanbom PARK ,  Sungkeun KOO ,  Jaeyoung HUH

IPC: H04M1/03 ,  G06F1/16 ,  H04R1/04 ,  H04R1/08

Abstract: In accordance with one aspect of the disclosure, an electronic device comprises a plate at least partially forming one surface of a housing and including a first through-hole; a printed circuit board disposed in the housing under the plate, the printed circuit having a second through-hole at least partly overlapping the first through-hole when viewed from above the first surface; a microphone disposed on a surface of the printed circuit board facing away from the plate, and at least partly overlapping the second through-hole when viewed from above the first surface; a seal member that is disposed between the plate and the printed circuit board around the first through-hole or the second through-hole; a support member that includes a first portion that faces the printed circuit board and includes an opening, the opening penetrated by the microphone, and a second portion that extends from the first portion and faces the plate; a first fixture the printed circuit board and the first portion; and a second fixture that is disposed between the plate and the second portion.

公开(公告)号：US20200322467A1

公开(公告)日：2020-10-08

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Seunghoon KANG ,  Boram KIM ,  Youngjin KIM ,  Sunghoon MOON ,  Hongki MOON ,  Yoonsun PARK ,  Hajoong YUN ,  Jonghoon LIM

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing

公开(公告)号：US20230350472A1

公开(公告)日：2023-11-02

申请号：US18346394

申请日：2023-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Seunghoon KANG ,  Boram KIM ,  Hongki MOON ,  Yoonsun PARK ,  Kyungwoo LEE ,  Seungjoo LEE ,  Jonghoon LIM

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC classification number: G06F1/203 ,  H01L23/427 ,  G06F1/206 ,  G06F1/1637

Abstract: Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.