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公开(公告)号:US20200083176A1
公开(公告)日:2020-03-12
申请号:US16207053
申请日:2018-11-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jae Hyun LIM , Chul Kyu KIM , Kyung Moon JUNG , Han KIM , Yoon Seok SEO
IPC: H01L23/552 , H01L23/31 , H01L23/367 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56
Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.
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公开(公告)号:US20190341354A1
公开(公告)日:2019-11-07
申请号:US16171126
申请日:2018-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyung Moon JUNG , Chul Kyu KIM , Seok Hwan KIM , Kyung Ho LEE , Seong Hwan PARK
IPC: H01L23/552 , H01L23/522 , H01L23/31 , H01L23/00
Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.
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公开(公告)号:US20190333837A1
公开(公告)日:2019-10-31
申请号:US16189025
申请日:2018-11-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seung On KANG , Seong Chan PARK , Chul Kyu KIM , Kee Ju UM , Myoung Hoon KIM , Han KIM
IPC: H01L23/373 , H01L23/31 , H01L23/498 , H01L23/367 , H01L23/433 , H01L25/10
Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.
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