公开(公告)号：US20200083176A1

公开(公告)日：2020-03-12

申请号：US16207053

申请日：2018-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun LIM ,  Chul Kyu KIM ,  Kyung Moon JUNG ,  Han KIM ,  Yoon Seok SEO

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

公开(公告)号：US20190341354A1

公开(公告)日：2019-11-07

申请号：US16171126

申请日：2018-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Moon JUNG ,  Chul Kyu KIM ,  Seok Hwan KIM ,  Kyung Ho LEE ,  Seong Hwan PARK

IPC: H01L23/552 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

公开(公告)号：US20190333837A1

公开(公告)日：2019-10-31

申请号：US16189025

申请日：2018-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung On KANG ,  Seong Chan PARK ,  Chul Kyu KIM ,  Kee Ju UM ,  Myoung Hoon KIM ,  Han KIM

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H01L25/10

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.