公开(公告)号：US20190333837A1

公开(公告)日：2019-10-31

申请号：US16189025

申请日：2018-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung On KANG ,  Seong Chan PARK ,  Chul Kyu KIM ,  Kee Ju UM ,  Myoung Hoon KIM ,  Han KIM

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H01L25/10

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.