公开(公告)号：US20220302087A1

公开(公告)日：2022-09-22

申请号：US17509610

申请日：2021-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONGJOO CHOI ,  SEUNGDUK BAEK

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L23/367

Abstract: A semiconductor package includes second semiconductor chip stacked on the first semiconductor chip, a chip adhesive layer between the first and second semiconductor chips, a quadrangular signal pillar and a quadrangular center dummy pillar between a central portion of the second semiconductor chip and the first semiconductor chip, an elliptical corner dummy pillar between a corner portion of the second semiconductor chip and the first semiconductor chip, a signal bump between the signal pillar and the first semiconductor chip, a center dummy bump between the center dummy pillar and the first semiconductor chip and a corner dummy bump section between the corner dummy pillar and the first semiconductor chip. The signal pillar and the signal bump provide an electrical path between the second semiconductor chip and the first semiconductor chip, the center dummy pillar and the center dummy bump provide one thermal path between the second semiconductor chip and the first semiconductor chip, and the corner dummy pillar and the corner dummy bump provide another thermal path between the second semiconductor chip and the first semiconductor chip.

公开(公告)号：US20250105182A1

公开(公告)日：2025-03-27

申请号：US18591546

申请日：2024-02-29

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： JAEYONG PARK ,  TAEHYEONG KIM ,  DONGJOO CHOI

IPC: H01L23/00 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor chip may include a body, and first bump pads disposed on a front surface of the body, including signal bump pads and power bump pads. The signal bump pads may be disposed in a central region of the body in a first direction along a second direction crossing the first direction. The power bump pads may include first power bump pads disposed along the first direction in a central region of the body in the second direction, and the second power bump pads may be disposed along the second direction on both sides of the first power bump pads in the first direction.