公开(公告)号：US20250096047A1

公开(公告)日：2025-03-20

申请号：US18624214

申请日：2024-04-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YEONGSEON KIM ,  DONGKUK LEE ,  CHAJEA JO

IPC: H01L21/66 ,  G01R31/28 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package includes a substrate. A first semiconductor chip is on the substrate and includes a first semiconductor substrate and a plurality of first test pads on a top surface of the first semiconductor substrate. A second semiconductor chip is on the first semiconductor chip and includes a second semiconductor substrate and a second test pad on a bottom surface of the second semiconductor substrate. The first semiconductor chip and the second semiconductor chip are bonded to each other. The plurality of first test pads face the second test pad. The second test pad has a circular ring shape when viewed in plan. The plurality of first test pads are arranged along a circumference of the second test pad. Areas that the plurality of first test pads overlap the second test pad have same sizes as each other.