公开(公告)号：US20240072091A1

公开(公告)日：2024-02-29

申请号：US18203677

申请日：2023-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINHO JANG ,  DOOWON KWON ,  DOYEON KIM ,  KYUNGTAE LIM

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L24/08 ,  H01L24/80 ,  H01L27/14636 ,  H01L27/1469 ,  H04N25/77

Abstract: An image sensor includes a lower substrate having a first surface and a second surface opposing the first surface, lower circuit devices disposed on the first surface, a lower wiring structure electrically connected to the lower circuit devices on the first surface, a lower bonding pad on the second surface, a lower bonding via penetrating through the lower substrate between the lower bonding pad and the lower wiring structure, a landing structure disposed on the first surface and contacting the lower bonding via, an upper bonding pad bonded to the lower bonding pad on the lower bonding pad, and an upper substrate disposed on the upper bonding pad and including photoelectric conversion devices. At least a portion of the landing structure horizontally overlaps the lower circuit devices.

公开(公告)号：US20200219912A1

公开(公告)日：2020-07-09

申请号：US16701750

申请日：2019-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： IN HO RO ,  DOOWON KWON ,  SEOKJIN KWON ,  JAMEYUNG KIM ,  JINYOUNG KIM ,  SUNGKI MIN ,  KWANSIK CHO ,  MANGEUN CHO ,  HO-CHUL JI

IPC: H01L27/146

Abstract: An image sensor including a semiconductor substrate having a first surface and a second surface, and a pixel region having a photoelectric conversion region; a first conductive pattern in a first trench defining the pixel region and extending from the first surface toward the second surface; a second conductive pattern in a second trench shallower than the first trench and defined between a plurality of active patterns on the first surface of the pixel region; a transfer transistor and a plurality of logic transistors on the active patterns; and a conductive line on the second surface and electrically connected to the first conductive pattern.