公开(公告)号：US12130034B2

公开(公告)日：2024-10-29

申请号：US17542600

申请日：2021-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok Hyun Jang ,  Jae-Yang Lee ,  Dong Han Ko ,  Yong Sang Kong ,  Suk Ho Lee ,  Min Chang

IPC: F24F11/49 ,  F24F11/58 ,  H04L9/32

CPC classification number: F24F11/49 ,  F24F11/58 ,  H04L9/3226

Abstract: Provided is a heat pump system including a compressor for compressing a refrigerant the heat pump system including: an input interface configured to receive an input of an authentication code; a display configured to display the authentication code input through the input interface; and a controller to control an operation of the heat pump system according to whether a control program to control the operation is to be activated based on the authentication code input through the input interface.