公开(公告)号：US20230142370A1

公开(公告)日：2023-05-11

申请号：US17959892

申请日：2022-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang Hyeon JEONG ,  Young Joo LEE ,  Young Bum KIM ,  Hyun Mog YOU ,  Dong Joon LEE ,  Chae Mook LIM ,  Woo Jung JUNG

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/11 ,  H01L22/26 ,  H01L2224/117

Abstract: A semiconductor package manufacturing method is provided. The semiconductor package manufacturing method which uses a semiconductor package manufacturing apparatus including a chuck, a solder device configured to attach solder balls to a substrate provided on the chuck, and a scanning device configured to provide information about a shape of the substrate to the chuck, wherein the chuck comprises an adsorbing portion comprising a plurality of divided regions, each of which is configured to adsorb the substrate, and a driver configured to drive each of the plurality of divided regions, the semiconductor package manufacturing method comprising driving each of the plurality of divided regions to correspond to the shape of the substrate based on the information using the driver.