SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
    2.
    发明公开

    公开(公告)号:US20230142370A1

    公开(公告)日:2023-05-11

    申请号:US17959892

    申请日:2022-10-04

    CPC classification number: H01L24/11 H01L22/26 H01L2224/117

    Abstract: A semiconductor package manufacturing method is provided. The semiconductor package manufacturing method which uses a semiconductor package manufacturing apparatus including a chuck, a solder device configured to attach solder balls to a substrate provided on the chuck, and a scanning device configured to provide information about a shape of the substrate to the chuck, wherein the chuck comprises an adsorbing portion comprising a plurality of divided regions, each of which is configured to adsorb the substrate, and a driver configured to drive each of the plurality of divided regions, the semiconductor package manufacturing method comprising driving each of the plurality of divided regions to correspond to the shape of the substrate based on the information using the driver.

    NEAR FIELD COMMUNICATION DEVICE
    4.
    发明申请

    公开(公告)号:US20190132027A1

    公开(公告)日:2019-05-02

    申请号:US16000007

    申请日:2018-06-05

    Abstract: A near field communication (NFC) device includes a communications module and a controller. The communications module includes a receiver to receive a wireless signal, a transmitter to transmit data by superimposing the data on the wireless signal, and a signal detector to compare the wireless signal with a predetermined reference signal. The communications module operates in at least one of a wakeup mode and a sleep mode, the receiver and transmitter are activated to operate in wakeup mode, and the receiver and transmitter are deactivated in sleep mode. The controller adjusts the sensitivity of the signal detector based on a magnitude of the wireless signal and an operating condition of the communications module when the communications module enters the wakeup mode from the sleep mode.

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