公开(公告)号：US20150349440A1

公开(公告)日：2015-12-03

申请号：US14666492

申请日：2015-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun SEOK ,  Dong-min JANG

IPC: H01R12/70 ,  H01R12/72

CPC classification number: H01R12/737

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract translation: 一种半导体模块插座，包括：内部包括槽的内部主体，半导体模块的下端部分插入到所述槽中，所述半导体模块包括其上具有半导体器件的印刷电路板;外部主体， 所述内部主体和所述槽的相对表面上的多个插座销，所述多个插座销彼此面对，并且所述多个插座销的顶部布置在不同的水平。