公开(公告)号：US20150373848A1

公开(公告)日：2015-12-24

申请号：US14625983

申请日：2015-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun SEOK

IPC: H05K1/11 ,  H05K1/18 ,  G11C11/401 ,  H01C13/02

CPC classification number: H01C13/02 ,  G11C5/04 ,  G11C7/10 ,  G11C11/401 ,  H05K1/117 ,  H05K3/3415 ,  H05K2201/0385 ,  H05K2201/09545 ,  H05K2201/10159

Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.

Abstract translation: 半导体模块包括印刷电路板，其包括集成电路芯片，印刷电路板的边缘处的连接端子以及分别将集成电路芯片的电连接焊盘连接到连接端子的信号线。 使用分别连接到信号线的印刷电路板的通孔来对连接端子进行电镀。

公开(公告)号：US20150349440A1

公开(公告)日：2015-12-03

申请号：US14666492

申请日：2015-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-hyun SEOK ,  Dong-min JANG

IPC: H01R12/70 ,  H01R12/72

CPC classification number: H01R12/737

Abstract: A semiconductor module socket includes an internal body including a slot therein, a lower end portion of a semiconductor module being inserted in the slot, and the semiconductor module including a printed circuit board with a semiconductor device thereon, an external body coupled to an outside of the internal body, and a plurality of socket pins on opposite surfaces of the slot, the plurality of socket pins facing each other, and top portions of the plurality of socket pins being arranged at different levels.

Abstract translation: 一种半导体模块插座，包括：内部包括槽的内部主体，半导体模块的下端部分插入到所述槽中，所述半导体模块包括其上具有半导体器件的印刷电路板;外部主体， 所述内部主体和所述槽的相对表面上的多个插座销，所述多个插座销彼此面对，并且所述多个插座销的顶部布置在不同的水平。