公开(公告)号：US20240091968A1

公开(公告)日：2024-03-21

申请号：US18132169

申请日：2023-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younhwan Shin ,  Dongju Jang

IPC: B26D1/00 ,  B26D1/06

CPC classification number: B26D1/0006 ,  B26D1/065 ,  B26D2001/006

Abstract: A blade for sawing a panel, including a first blade portion configured to saw the panel along a first direction, wherein the panel includes a plurality of panel level packages (PLPs) arranged in the first direction and a second direction which is substantially perpendicular to the first direction; and a second blade portion arranged on an upper surface of the first blade portion, and configured to saw the panel along the second direction, wherein a width of the second blade portion is greater than a width of the first blade portion.

公开(公告)号：US12288743B2

公开(公告)日：2025-04-29

申请号：US17655573

申请日：2022-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junwoo Park ,  Seunghwan Kim ,  Jungjoo Kim ,  Yongkwan Lee ,  Dongju Jang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a lower substrate that includes a lower wiring layer; a semiconductor chip disposed on the lower substrate, and an upper substrate disposed on the semiconductor chip. The upper substrate includes a lower surface that faces the semiconductor chip, an upper wiring layer, and a plurality of protruding structures disposed below the lower surface. The lower surface of the upper substrate includes a cavity region that overlaps the semiconductor chip in a first direction, and a plurality of channel regions that extend from the cavity region to an edge of the upper substrate. The cavity region and the plurality of channel regions are defined by the plurality of protruding structures.