公开(公告)号：US09111823B2

公开(公告)日：2015-08-18

申请号：US13757988

申请日：2013-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-Ho Kim ,  Duck-Hyung Lee ,  Young-Hoon Park

IPC: H01L27/146

CPC classification number: H01L27/146 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14689

Abstract: An image sensor having a sensor array area, a circuit area around the sensor array area, and a pad area adjacent to the circuit area includes a substrate, a multi-layer wiring structure including a plurality of wiring layers on a first surface of the substrate in the circuit area, at least one well in the substrate in the circuit area, and metal wiring that extends on a second surface of the substrate opposite to the first surface, from the pad area to the circuit area, and extends from the second surface into contacts with the at least one well.

Abstract translation: 具有传感器阵列区域，传感器阵列区域周围的电路区域和与电路区域相邻的焊盘区域的图像传感器包括：衬底;在衬底的第一表面上包括多个布线层的多层布线结构 在所述电路区域中，所述电路区域中的所述基板中的至少一个阱以及在所述基板的与所述第一表面相反的第二表面上从所述焊盘区域延伸到所述电路区域的金属布线，并且从所述第二表面 与至少一个井接触。