公开(公告)号：US20200083163A1

公开(公告)日：2020-03-12

申请号：US16684907

申请日：2019-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Akihisa KUROYANAGI ,  Jun Woo MYUNG ,  Eun Sil KIM ,  Yeong A KIM

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L23/538

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip disposed in the recess portion; a resin layer disposed on an active surface of the semiconductor chip; an encapsulant covering at least portions of side surfaces of the semiconductor chip and the resin layer and filling at least portions of the recess portion; a first redistribution layer disposed on the resin layer and the encapsulant; first redistribution vias penetrating through the resin layer to fill via holes in the resin layer exposing at least portions of the connection pads and electrically connecting the connection pads and the first redistribution layer to each other; and a connection member disposed on the resin layer and the encapsulant and including one or more second redistribution layers.

公开(公告)号：US20200152538A1

公开(公告)日：2020-05-14

申请号：US16746181

申请日：2020-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Woo MYUNG ,  Akihisa KUROYANAGI ,  Yeong A. KIM ,  Eun Sil KIM

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/29

Abstract: A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.