公开(公告)号：US20200152538A1

公开(公告)日：2020-05-14

申请号：US16746181

申请日：2020-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Woo MYUNG ,  Akihisa KUROYANAGI ,  Yeong A. KIM ,  Eun Sil KIM

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/29

Abstract: A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.