公开(公告)号：US20240128190A1

公开(公告)日：2024-04-18

申请号：US18486546

申请日：2023-10-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwan Kim ,  Yongkwan Lee ,  Gyuhyeong Kim ,  Jungjoo Kim ,  Jongwan Kim ,  Junwoo Park ,  Taejun Jeon ,  Junhyeung Jo

IPC: H01L23/528 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5283 ,  H01L21/485 ,  H01L21/56 ,  H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/05008 ,  H01L2224/13026

Abstract: A semiconductor package includes a lower substrate including a lower interconnection layer; an upper substrate on the lower substrate, a recessed surface having a step difference, and an upper interconnection layer having a through-hole extending from the recessed surface to the first surface of the upper substrate and electrically connected to the lower interconnection layer; semiconductor chip between the recessed surface of the upper substrate and the lower substrate and including connection pads electrically connected to the lower interconnection layer; interconnect structure between the second surface of the upper substrate and the lower substrate and electrically connecting the lower interconnection layer to the upper interconnection layer; and an insulating member including a first portion covering at least a portion of the semiconductor chip and interconnect structure, a second portion extending from the first portion into the through-hole, and a third portion covering at least a portion of the first surface.