公开(公告)号：US20180143671A1

公开(公告)日：2018-05-24

申请号：US15820791

申请日：2017-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hae Jin LEE ,  Kyung Ha KOO ,  Jung Je BANG ,  Chi Hyun CHO

IPC: G06F1/20 ,  G11B33/14

Abstract: An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.