公开(公告)号：US10327087B2

公开(公告)日：2019-06-18

申请号：US15838662

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-cheol Lee ,  Hae-jong Kim

IPC: H03F1/08 ,  H04S7/00 ,  H03F3/217 ,  H03F3/187 ,  H03F3/21 ,  H03F3/68 ,  H04R3/00 ,  H04R5/04 ,  H04R3/12

Abstract: There is provided an amplifier module which includes a plurality of input terminals; a plurality of amplifier circuits configured to amplify a plurality of input signals which are input from each of the plurality of input terminals and output a plurality of amplified signals; and at least one speaker which is directly connected to at least one output terminals from among the plurality of amplifier circuits, wherein the amplifier module may output the plurality of amplified signals to the at least one speaker based on a number of the at least one speaker.