公开(公告)号：US20250125174A1

公开(公告)日：2025-04-17

申请号：US18830715

申请日：2024-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haechul KIM ,  Wonjun CHA ,  Hyeondong SONG ,  Hoyeon JANG ,  Minho KIM

IPC: H01L21/673 ,  H01L21/67

Abstract: A cooling station includes: a lower plate; an upper plate spaced apart from the lower plate; a support structure having ends installed on the lower plate and the upper plate, respectively; and a seating member installed on the support structure for a wafer to be seated on the seating member, wherein the seating member has an inclined portion, wherein the wafer is seated on the inclined portion.