公开(公告)号：US20210111007A1

公开(公告)日：2021-04-15

申请号：US16865493

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang KIM ,  Keonwoo KIM ,  Eungsu KIM ,  Hakyoung KIM ,  Heewon MIN ,  Kyeongtea BANG ,  Seungwon SHIN ,  Dongyun YEO ,  Hyanjung LEE ,  Kyeongseok JEONG

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.

公开(公告)号：US20230061469A1

公开(公告)日：2023-03-02

申请号：US17877209

申请日：2022-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hakyoung KIM ,  Kyoungwon KIM ,  Wookwang LEE

IPC: G06F11/26 ,  G06F1/30

Abstract: An electronic device is provided. The electronic device includes a connector including one or more signal terminals and a control circuit electrically connected with the one or more signal terminals. The control circuit may be configured to monitor attachment with an external device through an identification terminal among the one or more signal terminals, identify whether a designated number of, or more, monitoring signals related to attachment with the external device are detected during a designated time, and identify whether there is the attachment with the external device, based on a voltage of a power terminal among the one or more signal terminals, in response to the detection of the monitoring signals being identified.

公开(公告)号：US20230005713A1

公开(公告)日：2023-01-05

申请号：US17552698

申请日：2021-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghee KIM ,  Dougyong SUNG ,  Taekjoon RHEE ,  Sungwook HONG ,  Hakyoung KIM ,  Sangmin JEONG

IPC: H01J37/32 ,  C23C16/02

Abstract: A method of manufacturing a semiconductor device includes: providing a first process gas including oxygen and a second process gas including carbon and fluorine to a process chamber at a first flow rate ratio to etch an etch target layer; and providing the first process gas and the second process gas to the process chamber at a second flow rate ratio to passivate the etch target layer, wherein a flow rate of the first process gas is substantially constant.

公开(公告)号：US20190080944A1

公开(公告)日：2019-03-14

申请号：US15952317

申请日：2018-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongwoo SUN ,  Hakyoung KIM ,  Yun-Kwang JEON ,  Wonyoung JEE

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.