公开(公告)号：US12038458B2

公开(公告)日：2024-07-16

申请号：US17524841

申请日：2021-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hoon Lee ,  Gyuyeol Kim ,  Yu-Kyum Kim ,  Hanjik Nam ,  Sehoon Park ,  Young Jun Park ,  Seungwon Jeong ,  Woojun Choi

IPC: G01R1/073 ,  G01R1/04 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06727

Abstract: A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.