公开(公告)号：US20150103494A1

公开(公告)日：2015-04-16

申请号：US14513436

申请日：2014-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hee-jeong Kim ,  Eun-Chul AHN ,  Yong-Kwan LEE

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K3/24 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/18161 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.

Abstract translation: 提供印刷电路板。 印刷电路板包括绝缘层，互连部分和金属层。 绝缘层具有平板形状并且包括顶表面和底表面。 互连部分设置在绝缘层的顶表面和底表面中的至少一个上。 互连部分包括多个互连图案。 金属层覆盖互连部分的多个互连图案。 还提供了相关的半导体封装。