公开(公告)号：US20200294917A1

公开(公告)日：2020-09-17

申请号：US16413039

申请日：2019-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kwan LEE ,  Yun Tae LEE ,  Young Sik HUR ,  Ho Kwon YOON ,  Won Wook SO

IPC: H01L23/528 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.