公开(公告)号：US20220059926A1

公开(公告)日：2022-02-24

申请号：US17517874

申请日：2021-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Wook SO ,  Jin Seon PARK ,  Young Sik HUR ,  Jung Chul GONG ,  Yong Ho BAEK

IPC: H01Q1/22 ,  H01Q1/24 ,  H01L23/00 ,  H01L23/66 ,  H01L23/31 ,  H01L23/522

Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

公开(公告)号：US20200058569A1

公开(公告)日：2020-02-20

申请号：US16523498

申请日：2019-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Hyun CHO ,  Young Sik HUR ,  Won Wook SO ,  Kyung Hwan KO ,  Yong Ho BAEK ,  Yong Duk LEE

IPC: H01L23/31 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

公开(公告)号：US20200294917A1

公开(公告)日：2020-09-17

申请号：US16413039

申请日：2019-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kwan LEE ,  Yun Tae LEE ,  Young Sik HUR ,  Ho Kwon YOON ,  Won Wook SO

IPC: H01L23/528 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.

公开(公告)号：US20200013743A1

公开(公告)日：2020-01-09

申请号：US16287064

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il KIM ,  Yong Ho BAEK ,  Won Wook SO ,  Young Sik HUR

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/04

Abstract: A semiconductor package includes a semiconductor chip including a body, a connection pad, a passivation film, a first connection bump disposed, and a first coating layer; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure including an insulating layer, a redistribution layer, and a connection via. The first connection bump includes a low melting point metal, the redistribution layer and the connection via include a conductive material, and the low melting point metal has a melting point lower than a melting point of the conductive material.

公开(公告)号：US20190280374A1

公开(公告)日：2019-09-12

申请号：US16112432

申请日：2018-08-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Il KIM ,  Dae Kwon JUNG ,  Young Sik HUR ,  Won Wook SO ,  Yong Ho BAEK ,  Woo Jung CHOI

IPC: H01Q1/38 ,  H05K1/11 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.