公开(公告)号：US10906283B2

公开(公告)日：2021-02-02

申请号：US16387032

申请日：2019-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae-Yeong Kim ,  Jun-Hyung Kim ,  Hoe-Chul Kim ,  Hoon-Joo Na ,  Kwang-Jin Moon

IPC: B32B37/00 ,  H01L21/687 ,  B32B37/10

Abstract: A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.

公开(公告)号：US11283235B2

公开(公告)日：2022-03-22

申请号：US16538044

申请日：2019-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Pil-Kyu Kang ,  Seok-Ho Kim ,  Tae-Yeong Kim ,  Hoe-Chul Kim ,  Hoon-Joo Na

IPC: H01S5/0236 ,  H01S5/02 ,  H01S5/323 ,  H01S5/02251

Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.