公开(公告)号：US20240103755A1

公开(公告)日：2024-03-28

申请号：US18531094

申请日：2023-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseb JEONG ,  Hongju KAL ,  Won Woo RO ,  Seokmin LEE ,  Gun KO

IPC: G06F3/06

CPC classification number: G06F3/0655 ,  G06F3/0604 ,  G06F3/0679

Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.

公开(公告)号：US20220398032A1

公开(公告)日：2022-12-15

申请号：US17837286

申请日：2022-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseb JEONG ,  Hongju KAL ,  Won Woo RO ,  Seokmin LEE ,  Gun KO

IPC: G06F3/06

Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.