公开(公告)号：US09912258B2

公开(公告)日：2018-03-06

申请号：US14842936

申请日：2015-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haejoong Park ,  Hongmyoung Kim ,  Kye Hyun Baek ,  Sangkyu Park

IPC: H01T23/00 ,  H02N13/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H02N13/00 ,  H01L21/67109 ,  H01L21/6831

Abstract: An electrostatic chuck assembly, including an electrostatic chuck on which a substrate is loaded; a channel that provides a flow passage for coolant in the electrostatic chuck, the channel having a first opening at a first end corresponding to a center of the substrate and a second opening at a second end corresponding to an edge of the substrate; and a valve box to control a flow direction of the coolant in the channel, the valve box including a first supply valve to control an introduction of the coolant into the first opening; a first return valve to control a drainage of the coolant from the second opening; a second supply valve to control an introduction of the coolant into the second opening; and a second return valve to control a drainage of the coolant from the first opening.