公开(公告)号：US20130300602A1

公开(公告)日：2013-11-14

申请号：US13861221

申请日：2013-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongyu Zhou ,  Farshid Aryanfar

IPC: H01Q3/24 ,  H01Q3/36

CPC classification number: H01Q3/247 ,  H01Q1/246 ,  H01Q3/36 ,  H01Q21/005 ,  H01Q21/0075 ,  H01Q21/065 ,  H01Q21/245 ,  H01Q25/02 ,  H04B7/10

Abstract: An apparatus includes an antenna array having multiple antenna elements arranged in multiple sub-arrays. The antenna elements are arranged in at least two different types of sub-arrays. The at least two different types of sub-arrays have substantially orthogonal electric field (E-field) orientations. The antenna elements can be arranged in multiple patch sub-arrays and multiple substrate integrated waveguide (SIW) sub-arrays, and the patch sub-arrays can be interleaved with the SIW sub-arrays. Each patch sub-array can include at least two patch antenna elements coupled in series, and each SIW sub-array can include a conductive plate and multiple slots in the conductive plate. The SIW sub-arrays can resonate at substantially a same frequency as the patch sub-arrays.

Abstract translation: 一种装置包括具有以多个子阵列排列的多个天线元件的天线阵列。 天线元件布置在至少两种不同类型的子阵列中。 至少两种不同类型的子阵列具有基本上正交的电场（E场）取向。 天线元件可以布置在多个贴片子阵列和多个衬底集成波导（SIW）子阵列中，并且补片子阵列可以与SIW子阵列交错。 每个贴片子阵列可以包括串联耦合的至少两个贴片天线元件，并且每个SIW子阵列可以包括导电板和导电板中的多个槽。 SIW子阵列可以以与补丁子阵列基本相同的频率谐振。

公开(公告)号：US09755311B2

公开(公告)日：2017-09-05

申请号：US13838469

申请日：2013-03-15

Applicant: Samsung Electronics Co., LTD

Inventor： Hongyu Zhou ,  Farshid Aryanfar

IPC: H01Q9/04 ,  H01Q21/00

CPC classification number: H01Q9/0407 ,  H01Q9/0428 ,  H01Q9/045 ,  H01Q21/0006

Abstract: For use in a wireless network, an apparatus for use in a wireless network includes an antenna having (i) a first patch element with two opposite corners truncated and (ii) a first microstrip line connected to a first side of the first patch element and configured to feed the first patch element. The first microstrip line forms an angle of substantially 45° with the first side of the first patch element. The antenna could also include (i) a second patch element with two opposite corners truncated and (ii) a second microstrip line connected to a side of the second patch element. The second microstrip line could form an angle of substantially 45° with the side of the second patch element. The patch elements could be series-coupled and form an antenna array. One patch element could represent a host patch element, and another patch element could represent a parasitic patch element.

公开(公告)号：US20140240186A1

公开(公告)日：2014-08-28

申请号：US14108071

申请日：2013-12-16

Applicant: Samsung Electronics Co., Ltd

Inventor： Hongyu Zhou ,  Farshid Aryanfar

IPC: H01Q13/00

CPC classification number: H01Q13/06 ,  H01Q21/205 ,  Y10T29/49018

Abstract: A system includes an antenna array and a transceiver configured to communicate wirelessly via the antenna array. The antenna array includes a substrate having first and second ground plates. The antenna array also includes multiple substrate integrated waveguide (SIW) antenna elements located along an edge of the substrate. The antenna array further includes feed lines configured to provide signals to the antenna elements and receive signals from the antenna elements. Each antenna element includes a waveguide between the first and second ground plates and enclosed by vias through the substrate, where the waveguide has one open edge along the edge of the substrate. The system could include multiple antenna arrays, where each antenna array includes multiple SIW antenna elements and the antenna arrays are located along different edges of the substrate.

Abstract translation: 一种系统包括天线阵列和配置成经由天线阵列无线通信的收发器。 天线阵列包括具有第一和第二接地板的衬底。 天线阵列还包括沿着衬底的边缘定位的多个衬底集成波导（SIW）天线元件。 天线阵列还包括被配置为向天线元件提供信号并从天线元件接收信号的馈线。 每个天线元件包括在第一和第二接地板之间的波导，并且被通过基板的通孔包围，其中波导沿着基板的边缘具有一个开口边缘。 该系统可以包括多个天线阵列，其中每个天线阵列包括多个SIW天线元件，并且天线阵列沿着衬底的不同边缘定位。

公开(公告)号：US20130321214A1

公开(公告)日：2013-12-05

申请号：US13838469

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Hongyu Zhou ,  Farshid Aryanfar

IPC: H01Q9/04

CPC classification number: H01Q9/0407 ,  H01Q9/0428 ,  H01Q9/045 ,  H01Q21/0006

Abstract: For use in a wireless network, an apparatus for use in a wireless network includes an antenna having (i) a first patch element with two opposite corners truncated and (ii) a first microstrip line connected to a first side of the first patch element and configured to feed the first patch element. The first microstrip line forms an angle of substantially 45° with the first side of the first patch element. The antenna could also include (i) a second patch element with two opposite corners truncated and (ii) a second microstrip line connected to a side of the second patch element. The second microstrip line could form an angle of substantially 45° with the side of the second patch element. The patch elements could be series-coupled and form an antenna array. One patch element could represent a host patch element, and another patch element could represent a parasitic patch element.

Abstract translation: 为了在无线网络中使用，用于无线网络的装置包括天线，其具有（i）具有两个相对角的第一贴片元件，以及（ii）连接到第一贴片元件的第一侧的第一微带线，以及 被配置为馈送第一贴片元件。 第一微带线与第一贴片元件的第一面形成大致45°的角度。 天线还可以包括（i）具有两个相对角的第二贴片元件，以及（ii）连接到第二贴片元件一侧的第二微带线。 第二微带线可以与第二贴片元件的侧面形成大致45°的角度。 贴片元件可以串联耦合并形成天线阵列。 一个补丁元件可以表示主机补丁元件，另一个补丁元素可以表示寄生补丁元件。

公开(公告)号：US10135149B2

公开(公告)日：2018-11-20

申请号：US14176941

申请日：2014-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongyu Zhou

IPC: H01Q13/10 ,  H01Q3/26 ,  H01Q1/24

Abstract: An apparatus includes an antenna element. The antenna element includes a first portion of a multi-layer printed circuit board (PCB) and a cap covering at least part of the first portion of the multi-layer PCB. The multi-layer PCB includes multiple substrates, and the first portion of the multi-layer PCB includes a first slot through the multiple substrates. The cap includes a second slot and defines a space between the first portion of the multi-layer PCB and the cap. The cap and a conductive layer of the multi-layer PCB form a waveguide structure through which wireless signals radiate from the antenna element.

公开(公告)号：US09742070B2

公开(公告)日：2017-08-22

申请号：US14108071

申请日：2013-12-16

Applicant: Samsung Electronics Co., LTD

Inventor： Hongyu Zhou ,  Farshid Aryanfar

IPC: H01Q13/06 ,  H01Q21/20

CPC classification number: H01Q13/06 ,  H01Q21/205 ,  Y10T29/49018

Abstract: A system includes an antenna array and a transceiver configured to communicate wirelessly via the antenna array. The antenna array includes a substrate having first and second ground plates. The antenna array also includes multiple substrate integrated waveguide (SIW) antenna elements located along an edge of the substrate. The antenna array further includes feed lines configured to provide signals to the antenna elements and receive signals from the antenna elements. Each antenna element includes a waveguide between the first and second ground plates and enclosed by vias through the substrate, where the waveguide has one open edge along the edge of the substrate. The system could include multiple antenna arrays, where each antenna array includes multiple SIW antenna elements and the antenna arrays are located along different edges of the substrate.

公开(公告)号：US20150035714A1

公开(公告)日：2015-02-05

申请号：US14176941

申请日：2014-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongyu Zhou

IPC: H01Q13/10

CPC classification number: H01Q13/106 ,  H01Q1/243 ,  H01Q3/26

Abstract: An apparatus includes an antenna element. The antenna element includes a first portion of a multi-layer printed circuit board (PCB) and a cap covering at least part of the first portion of the multi-layer PCB. The multi-layer PCB includes multiple substrates, and the first portion of the multi-layer PCB includes a first slot through the multiple substrates. The cap includes a second slot and defines a space between the first portion of the multi-layer PCB and the cap. The cap and a conductive layer of the multi-layer PCB form a waveguide structure through which wireless signals radiate from the antenna element.

Abstract translation: 一种装置包括天线元件。 天线元件包括多层印刷电路板（PCB）的第一部分和覆盖多层PCB的第一部分的至少一部分的盖。 多层PCB包括多个基板，并且多层PCB的第一部分包括通过多个基板的第一槽。 盖包括第二槽并且限定多层PCB的第一部分和盖之间的空间。 多层PCB的盖和导电层形成无线信号从天线元件辐射的波导结构。