公开(公告)号：US12126098B2

公开(公告)日：2024-10-22

申请号：US17899750

申请日：2022-08-31

申请人： Northrop Grumman Systems Corporation

发明人： Dah-Weih Duan ,  Elizabeth T Kunkee

IPC分类号： H01Q9/04 ,  C23C14/02 ,  C23C14/18 ,  C23C14/34 ,  C23C28/02 ,  C25D3/48 ,  C25D5/54 ,  C25D7/12 ,  H01Q1/48

CPC分类号： H01Q9/0407 ,  C23C14/022 ,  C23C14/185 ,  C23C14/34 ,  C23C28/023 ,  C25D3/48 ,  C25D5/54 ,  C25D7/123 ,  H01Q1/48

摘要： An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

公开(公告)号：US12126097B2

公开(公告)日：2024-10-22

申请号：US17785907

申请日：2020-12-21

申请人： KYOCERA CORPORATION

发明人： Hiromichi Yoshikawa ,  Satoshi Ishikawa

IPC分类号： H01Q9/04 ,  H01Q1/24 ,  H01Q5/10 ,  H01Q5/378

CPC分类号： H01Q9/0407 ,  H01Q1/24 ,  H01Q5/10 ,  H01Q5/378

摘要： To provide a novel antenna, wireless communication module, and wireless communication device excellent in long-term reliability. The antenna includes a first conductor, a second conductor facing the first conductor in a first direction, a third conductor, a fourth conductor, a power supply line configured to be electromagnetically connected to the third conductor, and a reinforcing member including a dielectric material. The third conductor extends along the first direction, is located between the first conductor and the second conductor, and is configured to capacitively connect the first conductor and the second conductor. The fourth conductor extends along the first direction and is configured to be electrically connected to the first conductor and the second conductor. The reinforcing member is located on at least a portion of any of the first conductor and the second conductor.

公开(公告)号：US12123902B2

公开(公告)日：2024-10-22

申请号：US17946832

申请日：2022-09-16

申请人： HELLA GmbH & Co. KGaA

发明人： Andreas John ,  Henrik Salheiser ,  Andreas Battray ,  Alessandro Vincente Ferrarotto

IPC分类号： G01R29/10 ,  H01Q1/12 ,  H01Q9/04 ,  H05K1/02 ,  H05K1/11

CPC分类号： G01R29/10 ,  H01Q1/12 ,  H01Q9/0407 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/10098

摘要： An antenna assembly for a transceiver having first antennas arranged on a circuit board, a transmitting and receiving circuit arranged on the circuit board. The first antennas are connected to the transmitting and receiving circuit. Second antennas and terminating resistors are arranged on the circuit board. Each second antenna is connected to one of the terminating resistors by means of a strip line. At least one first contact for measuring HF properties of one of the second antennas and/or at least one second contact for measuring HF properties of the terminating resistor connected to the measurement antenna is arranged on the circuit board. The strip line between the measurement antenna and the terminating resistor is disconnectable at a disconnection point, and the strip line forms, on the side of the disconnection point nearest the measurement antenna, a third contact for measuring the HF properties of the measurement antenna.

公开(公告)号：US12088024B2

公开(公告)日：2024-09-10

申请号：US17794535

申请日：2020-10-30

申请人： Huawei Technologies Co., Ltd.

发明人： Yongchao Wang ,  Xiaoqiang Yang ,  Cheng Gou ,  Jie Peng

IPC分类号： H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q13/10 ,  H01Q21/24 ,  H01Q15/24

CPC分类号： H01Q9/0407 ,  H01Q1/246 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q13/10 ,  H01Q15/24 ,  H01Q21/24

摘要： An antenna having high isolation and a low cross-polarization level, a base station, and a terminal are provided. The antenna includes a radiation layer, a feed layer, and an aperture coupling layer disposed between the radiation layer and the feed layer. The aperture coupling layer includes a metal sheet. A first feeding slot, a second feeding slot, and a middle slot are configured in the metal sheet. The middle slot is located between the first feeding slot and the second feeding slot, and is located in a weak electric field region of the metal sheet. The middle slot is configured between the first feeding slot and the second feeding slot of the metal sheet.

公开(公告)号：US12088000B2

公开(公告)日：2024-09-10

申请号：US17992850

申请日：2022-11-22

申请人： GUANGZHOU SHIYUAN ELECTRONIC TECHNOLOGY COMPANY LIMITED

发明人： Bingjie Deng ,  Guofeng Hong ,  Yanxi Chen

IPC分类号： H01Q1/22 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q21/06

CPC分类号： H01Q1/2291 ,  H01Q1/48 ,  H01Q1/526 ,  H01Q9/0407 ,  H01Q21/06

摘要： An interactive white board includes a display screen, a metal backboard, an antenna assembly, and a mainboard, wherein the metal backboard is located behind the display screen, and is provided with through holes, the antenna assembly is disposed on a surface of the metal backboard facing away from the display screen, and is located in a display region of the display screen, the antenna assembly is disposed directly opposite to the through holes, the mainboard is provided on the surface of the metal backboard facing away from the display screen, and the antenna assembly is electrically connected with the mainboard.

公开(公告)号：US20240297432A1

公开(公告)日：2024-09-05

申请号：US18647106

申请日：2024-04-26

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Po-Yao Chuang ,  Po-Hao Tsai ,  Shin-Puu Jeng

IPC分类号： H01Q1/22 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/82 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H01Q9/04 ,  H01Q19/10

CPC分类号： H01Q1/2283 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01Q9/0407 ,  H01Q19/10 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/92225 ,  H01L2224/95001 ,  H01L2924/1421

摘要： A method includes bonding an antenna substrate to a redistribution structure. The antenna substrate has a first part of a first antenna, and the redistribution structure has a second part of the first antenna. The method further includes encapsulating the antenna substrate in an encapsulant, and bonding a package component to the redistribution structure. The redistribution structure includes a third part of a second antenna, and the package component includes a fourth part of the second antenna.

公开(公告)号：US12080960B2

公开(公告)日：2024-09-03

申请号：US17987908

申请日：2022-11-16

申请人： ASUSTeK COMPUTER INC.

发明人： Muhammad Idrees Magray ,  Saou-Wen Su

IPC分类号： H01Q9/04 ,  H01Q1/24 ,  H01Q1/42 ,  H01Q13/08

CPC分类号： H01Q9/0407 ,  H01Q1/425 ,  H01Q13/08

摘要： A wideband millimeter-wave antenna device includes an antenna radiation layer and a transparent metasurface layer. The antenna radiation layer is below a transparent panel of a display panel and maintains a spaced height from the transparent panel. The transparent metasurface layer is on an upper surface of the transparent panel. The antenna radiation layer includes a dielectric substrate, a radiating metal portion, and a ground plane. The dielectric substrate is below the transparent panel and includes a first surface and a second surface, and the first surface faces the transparent panel. The radiating metal portion is on the first surface. The ground plane is on the second surface. The transparent metasurface layer includes a transparent substrate and metasurface units. The transparent substrate is on the upper surface of the transparent panel. The metasurface units are on the transparent substrate. Each metasurface unit is formed by a diamond-grid metal wire.

公开(公告)号：US12074365B2

公开(公告)日：2024-08-27

申请号：US17462516

申请日：2021-08-31

申请人： InnoLux Corporation

发明人： I-Yin Li ,  Yi-Hung Lin ,  Chin-Lung Ting ,  Tang-Chin Hung ,  Jeng-Nan Lin

IPC分类号： H01Q1/00 ,  H01Q1/36 ,  H01Q3/44 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q21/00 ,  G02F1/1339

CPC分类号： H01Q1/36 ,  H01Q3/44 ,  H01Q9/0407 ,  H01Q13/106 ,  H01Q21/0006 ,  G02F1/1339

摘要： An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

公开(公告)号：US12074362B2

公开(公告)日：2024-08-27

申请号：US17980128

申请日：2022-11-03

申请人： Samsung Electronics Co., Ltd.

发明人： Sungsoo Kim ,  Jaehoon Jo ,  Yongyoun Kim ,  Dongyoung Lee ,  Woomin Jang ,  Seungbum Choi

IPC分类号： H01Q1/24 ,  G01D5/24 ,  G01L1/14 ,  H01Q9/04

CPC分类号： H01Q1/243 ,  G01D5/24 ,  G01L1/142 ,  H01Q9/0407

摘要： An electronic device is provided. The electronic device includes a housing including a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, an antenna including a carrier including a first carrier surface facing the side surface, a second carrier surface opposite to the first carrier surface and a plurality of side carrier surfaces between the first carrier surface and the second carrier surface, and a patch positioned on the first carrier surface, a first capacitive sensor positioned between the first carrier surface and the side surface, and a filler positioned between the side surface and the first carrier surface.

公开(公告)号：US12074361B2

公开(公告)日：2024-08-27

申请号：US17982143

申请日：2022-11-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seongjin Park ,  Kiwon Kim ,  Hyunkee Min ,  Jaebong Chun ,  Ilpyo Hong

IPC分类号： H01Q1/24 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/04 ,  H01Q21/08 ,  H01Q25/00

CPC分类号： H01Q1/2291 ,  H01Q7/00 ,  H01Q9/0407 ,  H01Q21/08 ,  H01Q25/002

摘要： An electronic device includes: an electronic device includes: a housing; a first antenna structure provided in an inner space of the housing, the first antenna structure including: a first substrate having a first substrate surface facing a first direction and a second substrate surface facing a second direction opposite to the first direction, the first substrate including a plurality of first insulating layers and a first ground layer disposed on at least one of the plurality of first insulating layers; and a conductive patch disposed on one of the plurality of first insulating layers and overlapping the first ground layer; and a second antenna structure disposed in an opening of the first substrate in the inner space of the housing, the second antenna structure including: a second substrate having a third substrate surface facing the first direction and a fourth substrate surface facing the second direction, the second substrate including a plurality of second insulating layers that are stacked and a second ground layer; and at least two antenna elements disposed on a second insulating layer, among the plurality of second insulating layers, that is closer to the third substrate surface than the fourth substrate surface, wherein the conductive patch at least partly surrounds the second antenna structure.