SYSTEM, APPARATUS, AND METHOD WITH IMMERSION COOLING

    公开(公告)号:US20240268068A1

    公开(公告)日:2024-08-08

    申请号:US18357493

    申请日:2023-07-24

    CPC classification number: H05K7/20281 H05K7/20236 H05K7/20272

    Abstract: An immersion cooling system including an electronic device including a plurality of boards, the electronic device being configured in the immersive cooling system to be immersed in refrigerant that a reservoir is configured to accommodate, a pump array including a plurality of pumps disposed inside the reservoir, each pump of the plurality of pumps configured to individually generate a flow of the refrigerant by performing a discharging of the refrigerant, and a controller, the controller being configured to individually control an operation of each pump of the plurality of pumps, determine a board of the plurality of boards that requires cooling, identify a pump corresponding to the determined board among the plurality of pumps, and increase a flow quantity of the refrigerant discharged from the identified pump.

Patent Agency Ranking