公开(公告)号：US20230418240A1

公开(公告)日：2023-12-28

申请号：US18462807

申请日：2023-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hunyoung RYU ,  Kijung KIM ,  Jonggwang JANG ,  Dasol JUN

IPC: G04G17/04 ,  H05K7/20 ,  G04G17/02 ,  G04G17/08 ,  H01Q1/44 ,  G04G19/00 ,  H01Q1/27

CPC classification number: G04G17/04 ,  H05K7/2039 ,  G04G17/02 ,  H01Q1/273 ,  H01Q1/44 ,  G04G19/00 ,  G04G17/08

Abstract: In various embodiments, an electronic device may comprise: a housing including a front plate, a rear plate opposite to the front plate, and a side frame surrounding the space between the front plate and the rear plate; and a printed circuit board disposed in the space and having a front end module (FEM) and a heating element comprising a thermally conductive material mounted thereon, wherein the side frame is segmented into at least a first metal portion and a second metal portion, a segmentation member comprising a non-conductive material is disposed between the first metal portion and the second metal portion, and the first metal portion is electrically connected to the front end module, and the second metal portion is connected to the heating element by heat transfer members comprising a thermal interface material.