公开(公告)号：US20240014163A1

公开(公告)日：2024-01-11

申请号：US18312191

申请日：2023-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Youn KIM ,  Eung Kyu KIM ,  Min Jun BAE ,  Hyeon Seok LEE ,  Seok Kyu CHOI

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L24/16 ,  H01L24/08 ,  H01L24/73 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L25/162 ,  H01L2224/08235 ,  H01L24/48 ,  H01L2224/26175 ,  H01L2924/1205 ,  H01L2224/16168 ,  H01L2224/32155 ,  H01L2224/48228 ,  H01L2224/73204

Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls. The metal pattern includes a first portion extending in a first direction, and a second portion connected to the first portion and extending in a second direction different from the first direction.