公开(公告)号：US20240061458A1

公开(公告)日：2024-02-22

申请号：US18501721

申请日：2023-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seki KIM ,  Shangho KIM ,  Yongjin LEE ,  Hyongmin LEE ,  Dongha LEE ,  Byeongbae LEE ,  Sungyong LEE

IPC: G05F1/575

CPC classification number: G05F1/575

Abstract: A system-on-chip according to an embodiment includes a core including a header switch circuit configured to transmit a power supply voltage applied to a first power rail as a supply voltage to a second power rail and a logic circuit configured to operate based on the supply voltage from the second power rail, and a low-dropout (LDO) regulator configured to regulate a magnitude of first current output to the second power rail based on a change in the supply voltage, wherein the LDO regulator is further configured to control on/off of a plurality of first header switches included in the header switch circuit based on an amount of the change in the supply voltage.