公开(公告)号：US20250051952A1

公开(公告)日：2025-02-13

申请号：US18925542

申请日：2024-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyunghwan SONG ,  Youngchun KIM ,  Inkyu KIM ,  Kidoc SON ,  Yurim SONG ,  Hyuckki LEE ,  Yongduk KWON ,  Goeun KIM ,  Jongbo KIM ,  Byounggyu PARK ,  Sungyoung HEO ,  Hyunsuk CHOI

IPC: C25D11/02 ,  H05K5/04

Abstract: According to various embodiments of the present disclosure, a method for implementing a structural color comprises: forming an oxide layer on at least a part of the surface of a metal substrate; coloring the oxide layer with a specified color, and sealing same; and etching at least a part of the surface of the oxide layer, wherein the etching operation may comprise dipping the metal substrate in a mixture solution of phosphoric acid and sulfuric acid.

公开(公告)号：US20230097742A1

公开(公告)日：2023-03-30

申请号：US17865589

申请日：2022-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghwan SONG ,  Goeun KIM ,  Youngchun KIM ,  Kidoc SON ,  Hyuckki LEE

IPC: G06F1/16 ,  C23F1/02

Abstract: According to an embodiment of the disclosure, a housing of an electronic device may include a first surface including a first portion having an irregularity formed thereon and a second portion spaced apart from the first portion and having an irregularity formed thereon. The irregularities formed on the first surface may be formed by etching. A maximum height of the irregularity formed on the first portion may be different from a maximum height of the irregularity formed on the second portion. The maximum height of irregularities formed on the first surface may gradually increase or decrease from the first portion to the second portion.

公开(公告)号：US20220408582A1

公开(公告)日：2022-12-22

申请号：US17682158

申请日：2022-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kidoc SON ,  Youngchun KIM ,  Byounggyu PARK ,  Kyunghwan SONG ,  Hyuckki LEE

IPC: H05K5/04 ,  C25D11/26 ,  B23H3/00 ,  C25D11/34

Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.