公开(公告)号：US09627126B2

公开(公告)日：2017-04-18

申请号：US14255237

申请日：2014-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Jong Moon ,  Bok-Sik Myung ,  Seong-Ho Shin

IPC: H05K1/18 ,  H01F27/28 ,  H05K1/16 ,  H05K1/02

CPC classification number: H01F27/2804 ,  H01F2027/2809 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/165

Abstract: A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element.