公开(公告)号：USD771890S1

公开(公告)日：2016-11-15

申请号：US29517542

申请日：2015-02-13

Applicant: Samsung Electronics Co., Ltd.

Designer： Hyung-Jun Kim

公开(公告)号：USD781015S1

公开(公告)日：2017-03-07

申请号：US29517543

申请日：2015-02-13

Applicant: Samsung Electronics Co., Ltd.

Designer： Hyung-Jun Kim

公开(公告)号：US11037766B2

公开(公告)日：2021-06-15

申请号：US16268790

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Nam Kim ,  Sung-Yeon Kim ,  Hyung-Jun Kim ,  Jong-Woo Sun ,  Sang-Rok Oh ,  Jung-Pyo Hong

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.