公开(公告)号：US10692820B2

公开(公告)日：2020-06-23

申请号：US16197957

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-won Kim ,  Jun-won Han ,  Yeon-woo Kim ,  Hye-yun Park ,  Cheol-sang Yoon ,  Kangtaek Lee ,  Hyungjoon Jeon ,  Young-Geon Song

IPC: C01G53/00 ,  H01M4/505 ,  H01M4/525 ,  C01B39/48 ,  H01M10/0525 ,  H01L23/00 ,  H01L21/02 ,  H01L23/373 ,  C09C1/04 ,  C09C3/08 ,  H01L23/498 ,  C09C3/12 ,  C09D179/00

Abstract: A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.