公开(公告)号：US20210183757A1

公开(公告)日：2021-06-17

申请号：US17017638

申请日：2020-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HWANG KIM ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US20210050297A1

公开(公告)日：2021-02-18

申请号：US16849629

申请日：2020-04-15

Applicant: Samsung Electronics Co., Ltd

Inventor： Jihwang Kim ,  Jeongmin Kang ,  Hyunkyu Kim ,  Jongbo Shim ,  Kyoungsei Choi

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package is provided including a package substrate. The package substrate includes a substrate pattern and a substrate insulation layer at least partially surrounding the substrate pattern. The package substrate has a groove. An external connection terminal is disposed below the package substrate. An embedded semiconductor device is disposed within the groove of the package substrate. The embedded semiconductor device includes a first substrate. A first active layer is disposed on the first substrate. A first chip pad is disposed on the first active layer. A buried insulation layer is disposed within the groove of the package substrate and at least partially surrounds at least a portion of a lateral surface of the embedded semiconductor device. A mounted semiconductor device is disposed on the package substrate and is connected to the package substrate and the embedded semiconductor device.

公开(公告)号：US12062605B2

公开(公告)日：2024-08-13

申请号：US18308433

申请日：2023-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/45 ,  H01L25/0657

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US11658107B2

公开(公告)日：2023-05-23

申请号：US17807894

申请日：2022-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/45 ,  H01L25/0657

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

公开(公告)号：US11367679B2

公开(公告)日：2022-06-21

申请号：US17017638

申请日：2020-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hwang Kim ,  Hyunkyu Kim ,  Jongbo Shim ,  Eunhee Jung ,  Kyoungsei Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.