公开(公告)号：US20180323175A1

公开(公告)日：2018-11-08

申请号：US16024940

申请日：2018-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ILSOO KIM ,  HEEYOUB KANG ,  YOUNG-ROK OH ,  KITAEK LEE ,  HWI-JONG YOO

IPC: H01L25/065 ,  H01L23/36 ,  H01L23/373

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

公开(公告)号：US20200176423A1

公开(公告)日：2020-06-04

申请号：US16783665

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ILSOO KIM ,  HEEYOUB KANG ,  YOUNG-ROK OH ,  KITAEK LEE ,  HWI-JONG YOO

IPC: H01L25/065 ,  H01L23/36 ,  H01L23/373 ,  H01L23/544 ,  H01L25/10 ,  H05K1/18

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

公开(公告)号：US20180138154A1

公开(公告)日：2018-05-17

申请号：US15812482

申请日：2017-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ILSOO KIM ,  HEEYOUB KANG ,  YOUNG-ROK OH ,  KITAEK LEE ,  HWI-JONG YOO

IPC: H01L25/065 ,  H01L23/36

Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.