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公开(公告)号:US20200176423A1
公开(公告)日:2020-06-04
申请号:US16783665
申请日:2020-02-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: ILSOO KIM , HEEYOUB KANG , YOUNG-ROK OH , KITAEK LEE , HWI-JONG YOO
IPC: H01L25/065 , H01L23/36 , H01L23/373 , H01L23/544 , H01L25/10 , H05K1/18
Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
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公开(公告)号:US20180138154A1
公开(公告)日:2018-05-17
申请号:US15812482
申请日:2017-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: ILSOO KIM , HEEYOUB KANG , YOUNG-ROK OH , KITAEK LEE , HWI-JONG YOO
IPC: H01L25/065 , H01L23/36
Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
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公开(公告)号:US20210272627A1
公开(公告)日:2021-09-02
申请号:US17034141
申请日:2020-09-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KITAEK LEE
IPC: G11C13/00
Abstract: A non-volatile memory device includes a memory cell array, a word line driver, a bit line driver, a read circuit, and control logic. The memory cell array includes a plurality of banks. Each bank includes a plurality of tiles. Each tile includes a plurality of resistive memory cells connected to a plurality of bit lines and a plurality of word lines. The word line driver selects one of the word lines in response to an input address. The bit line driver selects one of the bit lines in response to the input address. The read circuit reads a code word from the memory cell array in a read operation. The control logic is configured to control the word line driver, the bit line driver, the read circuit in the read operation. The control logic performs an address scramble on the input address, and provides the scrambled address to the read circuit to access the plurality of tiles in the read operation.
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公开(公告)号:US20180323175A1
公开(公告)日:2018-11-08
申请号:US16024940
申请日:2018-07-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: ILSOO KIM , HEEYOUB KANG , YOUNG-ROK OH , KITAEK LEE , HWI-JONG YOO
IPC: H01L25/065 , H01L23/36 , H01L23/373
Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
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