公开(公告)号：US20210151370A1

公开(公告)日：2021-05-20

申请号：US17162015

申请日：2021-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Jun CHOI ,  Jae Ean LEE ,  Kwang Ok JEONG ,  Young Gwan KO ,  Jung Soo BYUN

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/528 ,  H01L21/48 ,  H01L23/522 ,  H01L21/56 ,  H01L23/00

Abstract: A method for manufacturing a semiconductor package includes disposing a semiconductor chip having contact pads, and a connection structure around the semiconductor chip on a supporting substrate, with the contact pads facing the supporting substrate, forming an encapsulant encapsulating the semiconductor chip and the connection structure on the supporting substrate, embedding a wiring pattern having a connection portion in the encapsulant, the connection portion having a connection hole, forming a through hole penetrating the encapsulant in the connection hole, the through hole exposing a portion of an upper surface of the connection structure, and forming a conductive via in the through hole, the conductive via connecting the wiring pattern to the connection structure.