公开(公告)号：US11195822B2

公开(公告)日：2021-12-07

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/54

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.

公开(公告)号：US20210066260A1

公开(公告)日：2021-03-04

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.