SEMICONDUCTOR TRANSPORT SYSTEM AND METHOD OF TRANSPORTING SEMICONDUCTOR

    公开(公告)号:US20240222147A1

    公开(公告)日:2024-07-04

    申请号:US18404333

    申请日:2024-01-04

    CPC classification number: H01L21/67 B65B11/58 B65B51/00 B65B57/00

    Abstract: A method of transporting a semiconductor is provided and includes: providing an accommodation container accommodating a wafer and including nitrogen gas to a packaging chamber; performing, in the packaging chamber, a first packaging on the accommodation container by packaging the accommodation container with vinyl; performing a second packaging on the accommodation container, on which the first packaging has been performed, by packaging the accommodation container with a logistics bag; transporting the accommodation container to a standby chamber and standing by the accommodation container in the standby chamber; and transporting the accommodation container that was in standby in the standby chamber by using a transporter in the transport chamber. A temperature of the standby chamber, in which the accommodation container is in standby, is maintained in a range of 18° C. to 23.5° C., and a humidity of the standby chamber is maintained in a range of 0% to 45%.

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