公开(公告)号：US20240243053A1

公开(公告)日：2024-07-18

申请号：US18457535

申请日：2023-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HWANG KIM ,  JOONSUNG KIM ,  SANGJIN BAEK ,  KYOUNG LIM SUK

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/165 ,  H01L2225/06517

Abstract: A semiconductor package includes a first redistribution layer; a first semiconductor chip above the first redistribution layer; a second semiconductor chip above the first semiconductor chip; a second redistribution layer above the second semiconductor chip; a first connection structure on the second redistribution layer; a connection post on the first connection structure; and a connection interconnection layer on the connection post, wherein the connection interconnection layer comprises a connection insulating layer and a connection via extending through the connection insulating layer, and wherein the second redistribution layer and the first redistribution layer are electrically connected to each other through a wire.