公开(公告)号：US10340277B2

公开(公告)日：2019-07-02

申请号：US15712479

申请日：2017-09-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae-Hoon Song ,  Kiheum Nam ,  Wonchul Lee

IPC分类号： H01L27/108 ,  H01L29/41 ,  H01L21/768 ,  H01L23/528 ,  H01L49/02 ,  H01L27/02

摘要： A semiconductor device includes a plurality of pillar structures on a semiconductor substrate, and a support pattern in contact with at least a part of each of the pillar structures, the support pattern connecting the pillar structures with one another, wherein the support pattern includes support holes exposing side surfaces of the pillar structures, the support holes including at least a first support hole and a second support hole that are spaced apart from each other, the first and second support holes having different shapes from each other.

公开(公告)号：US10720435B2

公开(公告)日：2020-07-21

申请号：US16440399

申请日：2019-06-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae-Hoon Song ,  Kiheum Nam ,  Wonchul Lee

IPC分类号： H01L27/108 ,  H01L29/41 ,  H01L21/768 ,  H01L23/528 ,  H01L49/02 ,  H01L27/02

摘要： A semiconductor device includes a plurality of pillar structures on a semiconductor substrate, and a support pattern in contact with at least a part of each of the pillar structures, the support pattern connecting the pillar structures with one another, wherein the support pattern includes support holes exposing side surfaces of the pillar structures, the support holes including at least a first support hole and a second support hole that are spaced apart from each other, the first and second support holes having different shapes from each other.

公开(公告)号：US11195837B2

公开(公告)日：2021-12-07

申请号：US16800105

申请日：2020-02-25

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae-Hoon Song ,  Kiheum Nam ,  Wonchul Lee

IPC分类号： H01L27/108 ,  H01L49/02 ,  H01L23/528 ,  H01L21/768 ,  H01L29/41 ,  H01L27/02

摘要： A semiconductor device comprises a plurality of pillars on a semiconductor substrate, and a support pattern in contact with at least one side surface of each of the pillars. The support pattern connects the pillars with one another. The support pattern includes a plurality of support holes that expose side surfaces of the pillars. The support holes includes a first support hole and a second support hole that are spaced apart from each other. The pillars have circular cross-sections. A ribbon-like hexagon is obtained in a plan view when connecting an inner sidewall of the first support hole with central points of the cross-sections of the pillars exposed through the first support hole.