公开(公告)号：US12098792B2

公开(公告)日：2024-09-24

申请号：US17672113

申请日：2022-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jauk Gu ,  Jonghee Choi

IPC: F16L37/098 ,  F16L5/06 ,  H01L21/67

CPC classification number: F16L37/098 ,  F16L5/06 ,  H01L21/67017

Abstract: A damper for an exhaust duct of an exhaust line of a semiconductor fabrication apparatus includes a damper body to be inserted into a fixing hole in the exhaust duct in a first direction, the damper body having a diameter substantially the same as a diameter of the fixing hole, and plural push buckles. The push buckles are provided on a distal end of the damper body along an outer circumferential surface of the damper body and spaced apart from each other around a circumference of the damper body, the push buckles being resilient and movable with respect to the outer circumferential surface along a second direction perpendicular to the first direction. When the push buckles have passed through the fixing hole in the first direction, the push buckles prevent a return movement through the fixing hole in a direction opposite to the first direction.