TEST SOCKET FOR A COMPONENT
    2.
    发明申请

    公开(公告)号:US20250093180A1

    公开(公告)日:2025-03-20

    申请号:US18765078

    申请日:2024-07-05

    Inventor: Jee-Hoon Ka

    Abstract: A test apparatus includes an image sensor module including a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal. The controller may control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and the criteria temperature range is a temperature range within a preset range from the target temperature.

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