公开(公告)号：US09748953B2

公开(公告)日：2017-08-29

申请号：US15202839

申请日：2016-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Jun Lee ,  Do-Hyung Kim ,  Yong-Jin Kim ,  Bo-Ra Kim ,  Jeong-Hoon Baek ,  Kwang-Seop Kim ,  Da-Ae Heo

IPC: H03K19/00 ,  G11C7/00 ,  G11C5/04

CPC classification number: H03K19/0005 ,  G11C5/04 ,  G11C7/00

Abstract: A memory module includes a command/address (CA) register, memory devices, and a module resistor unit mounted on a circuit board. The centrally disposed CA register drive the memory devices one or more internal CA signal(s) to arrangements of memory devices using multiple CA transmission lines, wherein the multiple internal CA transmission lines are commonly terminated in the module resistor unit.