公开(公告)号：US20240112881A1

公开(公告)日：2024-04-04

申请号：US18196499

申请日：2023-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyeok PARK ,  Kwangrak KIM ,  Jiwoong KIM ,  Hyenok PARK ,  Jeonghyeon WANG ,  Myungjun LEE ,  Yunje CHO ,  Junghee CHO ,  Yun HWANG

IPC: H01J37/28 ,  G01B11/22 ,  H01J37/20 ,  H01J37/304 ,  H01J37/305

CPC classification number: H01J37/28 ,  G01B11/22 ,  H01J37/20 ,  H01J37/304 ,  H01J37/305 ,  H01J37/1472 ,  H01J2237/24578

Abstract: A substrate analysis system includes a load-lock module configured to load or unload a substrate on which a pattern layer is formed; a milling module configured to form a milling surface from which at least a portion of the pattern layer is removed; a depth measuring module configured to measure a milling depth of an analysis region formed on the milling surface; an imaging module configured to capture a two-dimensional image of the analysis region; and a control module controlling the substrate to circulate through the milling module, the depth measuring module, and the imaging module, when the milling depth is shallower than a set target depth, wherein the milling module adjusts a path of the ion beam so that the ion beam moves horizontally in the milling region according to a scanning profile received based on an intensity map of the ion beam.