SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20220384325A1

    公开(公告)日:2022-12-01

    申请号:US17677012

    申请日:2022-02-22

    Abstract: A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first connection extending in a second direction intersecting the first direction and connecting the first extension and the second extension, and a redistribution structure that covers an upper surface of the pad insulating film, first interposer bumps on a lower surface of the interposer and spaced apart from each other, at least a part of each of the first and second extensions being connected to one of the first interposer bumps, and a first semiconductor chip on an upper surface of the interposer and electrically connected to the redistribution structure.

    APPARATUS AND METHOD FOR MEASURING BIO-SIGNAL

    公开(公告)号:US20230157551A1

    公开(公告)日:2023-05-25

    申请号:US17677059

    申请日:2022-02-22

    CPC classification number: A61B5/0095 A61B5/02416

    Abstract: An apparatus for measuring a bio-signal includes: a light source configured to emit light; an ultrasonic transducer configured to obtain a photoacoustic signal generated from an object; a photoacoustic coupler disposed in contact with the ultrasonic transducer and configured to direct the light transmitted from the light source to a scanner and to direct the photoacoustic signal generated from the object to the ultrasonic transducer; the scanner configured to reflect the light incident from the photoacoustic coupler to the object, and reflect the photoacoustic signal generated from the object to the photoacoustic coupler; a scanner controller configured to adjust a light incident position on the object by controlling the angle of the scanner; a light detector configured to obtain a light signal by detecting the light scattered or reflected from the object; and a processor configured to obtain bio-information based on the light signal and the photoacoustic signal.

    IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20220068981A1

    公开(公告)日:2022-03-03

    申请号:US17342173

    申请日:2021-06-08

    Abstract: An image sensor is provided. The image sensor includes a substrate including a first side on which light is incident and a second side opposite the first side; a first separation pattern extending from the second side, the first separation pattern being interposed between unit pixels in the substrate of a light-receiving region and a light-shielding region provided around the light-receiving region; a second separation pattern extending from the first side and overlapping the first separation pattern, the second separation pattern being provided in the substrate of the light-receiving region; and a contact film electrically connected to the first separation pattern, the contact film being provided in the substrate of the light-shielding region. A contact trench which extends from the first side is formed in the light-shielding region of the substrate and exposes the first separation pattern, and the contact film fills at least a part of the contact trench.

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