-
公开(公告)号:US20220384325A1
公开(公告)日:2022-12-01
申请号:US17677012
申请日:2022-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jun Hyeong PARK , Jin Young KIM , Young Kwan SEO
IPC: H01L23/498 , H01L25/065 , H01L21/48
Abstract: A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first connection extending in a second direction intersecting the first direction and connecting the first extension and the second extension, and a redistribution structure that covers an upper surface of the pad insulating film, first interposer bumps on a lower surface of the interposer and spaced apart from each other, at least a part of each of the first and second extensions being connected to one of the first interposer bumps, and a first semiconductor chip on an upper surface of the interposer and electrically connected to the redistribution structure.
-
公开(公告)号:US20220155259A1
公开(公告)日:2022-05-19
申请号:US17206358
申请日:2021-03-19
Inventor: Chulhong KIM , Jin Young KIM , Hyojin KIM , Jin Woo BAIK , Joongho AHN
Abstract: A photoacoustic apparatus may include: a ring transducer configured to measure a photoacoustic signal generated from an object, and including a hollow space that is provided as a travel path of light and ultrasonic waves; a mirror part disposed along a light path of the light transmitted from the ring transducer, and configured to reflect the light transmitted from the ring transducer, and the ultrasonic waves generated from the object, and to adjust magnification of the mirror part according to a number of apertures of the photoacoustic apparatus; and a fluid tank including a transparent film that allows the photoacoustic signal to pass through the fluid tank, and accommodating a fluid, the ring transducer, and the mirror part inside the fluid tank.
-
公开(公告)号:US20230157551A1
公开(公告)日:2023-05-25
申请号:US17677059
申请日:2022-02-22
Inventor: Sung Hyun NAM , Chulhong KIM , Ka Ram CHOI , Jin Young KIM , Jin Woo BAIK , Joongho AHN
CPC classification number: A61B5/0095 , A61B5/02416
Abstract: An apparatus for measuring a bio-signal includes: a light source configured to emit light; an ultrasonic transducer configured to obtain a photoacoustic signal generated from an object; a photoacoustic coupler disposed in contact with the ultrasonic transducer and configured to direct the light transmitted from the light source to a scanner and to direct the photoacoustic signal generated from the object to the ultrasonic transducer; the scanner configured to reflect the light incident from the photoacoustic coupler to the object, and reflect the photoacoustic signal generated from the object to the photoacoustic coupler; a scanner controller configured to adjust a light incident position on the object by controlling the angle of the scanner; a light detector configured to obtain a light signal by detecting the light scattered or reflected from the object; and a processor configured to obtain bio-information based on the light signal and the photoacoustic signal.
-
公开(公告)号:US20220068981A1
公开(公告)日:2022-03-03
申请号:US17342173
申请日:2021-06-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hae Sung JUNG , Tae-Hun LEE , Jin Young KIM
IPC: H01L27/146
Abstract: An image sensor is provided. The image sensor includes a substrate including a first side on which light is incident and a second side opposite the first side; a first separation pattern extending from the second side, the first separation pattern being interposed between unit pixels in the substrate of a light-receiving region and a light-shielding region provided around the light-receiving region; a second separation pattern extending from the first side and overlapping the first separation pattern, the second separation pattern being provided in the substrate of the light-receiving region; and a contact film electrically connected to the first separation pattern, the contact film being provided in the substrate of the light-shielding region. A contact trench which extends from the first side is formed in the light-shielding region of the substrate and exposes the first separation pattern, and the contact film fills at least a part of the contact trench.
-
-
-